| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring substrate wherein the wiring substrate which is thin and has high density is efficiently manufactured. <P>SOLUTION: The method for manufacturing the wiring substrate includes the stages of: laminating an insulating layer 21 formed of an electric insulating material containing a resin on a metal foil 12P with a base film which includes the metal foil 12P held on the base film 1 with an adhesive layer interposed, and forming a plurality of via holes V in the insulating layer 21; depositing and bonding a first wiring conductor 11, formed of a plated conductor connected to the metal foil 12P, in a predetermined pattern on the insulating layer 21 and in the via holes V; and separating the metal foil 12P supported on the base film 1 and a laminate 10 including the insulating layer 21 and first wiring conductor 11 from the base film 1. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
