| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for appropriately applying an underfill resin to a base package. SOLUTION: A first part (11) and a second part (12) are provided to a temperature control stage (7) of the device for manufacturing semiconductor device. Hereat, the first part (11) imparts the heat of a first temperature to a resin (5) between a substrate (2) and a chip (3) through the substrate (2). The second part (12) is constructed in the periphery of the first part (11). The second part (12) imparts the heat of a second temperature lower than the first temperature to the substrate (2). COPYRIGHT: (C)2009,JPO&INPIT
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