LEAD FRAME HAVING HEAT SINK SUPPORTING RING, MANUFACTURING METHOD FOR LIGHT EMITTING DIODE PACKAGE USING THE FRAME, AND LIGHT EMITTING DIODE PACKAGE MANUFACTURED BY USING THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a lead frame having a heat sink supporting ring, a method for manufacturing a light emitting diode package by using the frame, and the light emitting diode package manufactured by using the method.

SOLUTION: This lead frame comprises: a supporting ring for supporting a heat sink; an outer frame separated from the supporting ring while surrounding the supporting ring; at least one supporting lead which connects the outer frame and the supporting ring; and at least one separated lead which extends from the outer frame toward but not connected to the supporting ring. In this way, a package body can be formed by using an insert molding technology after taking the heat sink in the lead frame, thereby providing a light emitting diode package which stable in structure and having a superior heat dissipation property.

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