| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transparent adhesive/sealing material which does not cause adherends to undergo separation, cracking, etc., with a view to solve the problem that some transparent sealing materials used for encapsulating a solar cell element in a solar cell module and for encapsulating a light reception unit in optical communication, light-emitting diodes (LEDs), etc., some adhesives for bonding semiconductor packages to heat sinks, and the like are apt to suffer from defects such as interfacial delamination due to insufficient adhesion to substrates. <P>SOLUTION: Separation from an adherend due to a temperature change in post-processing and use and crack formation are prevented by performing heat sealing/bonding by using a base resin prepared by adding an oligomer obtained previously hydrolytically polycondensing an alkoxysilane containing an aromatic or aromatic-containing hydrocarbon group to an alkoxysilane as a raw material, mixing the mixture with an organic solvent, water, and an acidic catalyst, and heating the resultant mixture under agitation. <P>COPYRIGHT: (C)2009,JPO&INPIT |
