发明名称 PACKAGE FOR ELECTRONIC COMPONENT STORAGE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a package for electronic component storage which includes a recess for electronic component storage penetrating a ceramic insulating layer, the package for electronic component storage suppressing a fall of a ceramic particle from a recess inner surface. <P>SOLUTION: The package 9 for electronic component storage includes, on an upper surface of an insulating base 1 formed by laminating a plurality of ceramic insulating layers 1a, the recess 2 for electronic component storage formed penetrating center portions of some of the ceramic insulating layers 1a along the thickness, the inner surface of the recess 2 being coated with a ceramic coating layer 3. The ceramic coating layer 3 suppresses a fall of a ceramic particle from the inner surface of the recess 2. Consequently, even when an electronic component 4 whose function is apt to be disturbed by sticking of the ceramic particle like a high-precision optical semiconductor element, an MEMS element, etc., is stored, reliability as an electronic device is easily enhanced. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009206115(A) 申请公布日期 2009.09.10
申请号 JP20080043872 申请日期 2008.02.26
申请人 KYOCERA CORP 发明人 ONISHI MASAHIRO;MITSUTAKE MASATAKA
分类号 H01L23/02;H01L23/08 主分类号 H01L23/02
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