SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip which efficiently radiates heat from the reverse surface side of a semiconductor substrate.

SOLUTION: A semiconductor chip 10 includes: the substrate 11; an integrated circuit 12 formed on an element formation surface side of the substrate 11 and including a plurality of semiconductor elements; and a heat-radiating plug 31 formed in a region of the substrate 11 corresponding to a prescribed semiconductor element 30 among the plurality of semiconductor elements. The heat-radiating plug 31 is made of a material having a thermal conductivity greater than that of the substrate 11 embedded in a non-penetrating hole having its opening on the surface on the opposite side from the element formation surface.

COPYRIGHT: (C)2009,JPO&INPIT