| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an output controller which can be made compact and low-cost by reducing a package size and has superior heat dissipation characteristics. <P>SOLUTION: A switching power MOSFET chip 22 is composed of a lateral power MOSFET, the switching power MOSFET chip 22 and a control IC chip 21 are mounted on a common island 19, and a portion of the common island 19 is exposed as an island exposed portion 20 to outside the package 18. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
