| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and a device for manufacturing the semiconductor device by which the breaking, chipping and warping of a wafer are reduced while suppressing the increase of production cost. SOLUTION: A ring-shaped first stage 10 and a second stage 20 which is columnar and larger in height than the first stage are installed in a base section 1 which is thicker at the outer peripheral end part than at the center part while matched with the shape of a reverse surface side of the wafer 30 installed on a dicing stage. When a rib wafer 30 is installed, a projection formed of the first stage 10 and second stage 20 is overlaid with a recess on the reverse surface side of the wafer. The wafer 30 includes its entire surface cut from the top surface side of the wafer 30 without cutting off a rib 32 to be parted into chips. COPYRIGHT: (C)2009,JPO&INPIT |
