| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method that suppresses or prevents the vaporization of a processing liquid discharged from a substrate. <P>SOLUTION: The substrate processing apparatus 1 includes a spin chuck 3, a processing liquid nozzle, and a cup 5. The processing liquid is supplied onto the top face of a wafer W while the wafer W is rotated by means of the spin chuck 3. The processing liquid supplied onto the wafer W is discharged from the wafer W by a centrifugal force and is received by the cup 5. At this point, while the processing liquid is discharged from the processing liquid nozzle, a cleaning liquid is concurrently discharged from a cleaning liquid nozzle 38, and hence the processing liquid received by the cup 5 is rapidly cleaned away and discharged through a drainage port 32. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
