| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the throughput of a dicing stage. <P>SOLUTION: A dicing device comprises a prealignment section 11c provided with a prealignment camera 11d to recognize a mark formed on a multipiece substrate 7; a dicing section 11e which dices the multipiece substrate 7 based upon information acquired through image recognition by the prealignment section 11c; and an XY table 11k conveying the multipiece substrate 7. The prealignment section 11c previously recognize all marks on the multipiece substrate 7 through the image processing to find dicing places, and then the dicing section 11e speedily cut the multipiece substrate with a blade 10 only by recognizing only several places through the alignment camera 11g. Consequently, the prealignment and dicing can be performed in parallel in the dicing stage to improve the throughput of the dicing stage. <P>COPYRIGHT: (C)2009,JPO&INPIT |
