| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module which is high in reliability and cooling function. <P>SOLUTION: The power module 10 includes semiconductor chips 11a and 11b where semiconductor elements are formed, a heat sink member 21 which dissipates heat generated by the semiconductor chips 11a and 11b to a heat exchanging medium, and metal wiring 23 and an insulating resin layer 26 interposed between the heat sink member 21 and semiconductor chips 11a and 11b. The heat sink member 24 is made of Si-SiC which has a small difference in coefficient of thermal expansion from the semiconductor chips 11a and 11b and high heat conductivity, and has a flat plate portion 21a and fin portions 21b projecting from the flat plate portion 21a to a region where they are exposed to the heat exchanging medium. <P>COPYRIGHT: (C)2009,JPO&INPIT |
