| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic substrate, in which a non-contraction process can be used without reference to the kind of an LTCC material, thereby manufacturing precision can be increased to attain smaller size and higher density, and a high-performance electronic device excellent in practicality can be manufactured. SOLUTION: A first green sheet 10 containing a foundation material such as a non-glass-based material is formed, a metal paste layer 11 containing metal components such as Ag and Cu is provided thereupon, and a restriction layer 12 is formed thereupon using paste containing a hard-to-sinter ceramic material. A laminate formed by, for example, thermocompression of them is baked under predetermined baking conditions and then the restriction layer 12 remaining as an unbaked body is removed to obtain a sintered laminate having a dielectric layer 10a formed by sintering the green sheet 10 and a conductor layer 11a formed by baking the metal paste layer 11. A wiring layer can be formed thereafter by patterning the conductor layer 11a. COPYRIGHT: (C)2009,JPO&INPIT |
