发明名称 Methods of manufcturing a semiconductor device
摘要 Isolation regions are formed on a substrate to define an active region. A gate electrode is formed on the active region. A spacer structure is formed on a sidewall of the gate electrode. A gate silicide layer is formed on the gate electrode and a source/drain silicide layer is formed on the active region adjacent to the gate electrode. An upper portion of the gate silicide layer and a portion of the spacer structure are simultaneously removed to form a spacer structure pattern and a gate silicide layer pattern. A stress layer is formed to cover the gate electrode and spacer structure pattern.
申请公布号 US2009227082(A1) 申请公布日期 2009.09.10
申请号 US20090381175 申请日期 2009.03.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN DONG-SUK;KIM KI-CHUL;LEE JUNG-DEOG
分类号 H01L21/76 主分类号 H01L21/76
代理机构 代理人
主权项
地址