发明名称 Method for fabricating semiconductor device
摘要 A method for fabricating a semiconductor device includes the steps of forming an oxide film on a silicon carbide substrate; forming a gate electrode layer on the oxide film thereafter to pattern the gate electrode layer so as to form a gate electrode, comprising: and performing a thermal treatment to the gate electrode layer or the gate electrode in a mixed gas atmosphere of an oxidized gas and an inert gas.
申请公布号 US2009227100(A1) 申请公布日期 2009.09.10
申请号 US20090379931 申请日期 2009.03.04
申请人 OKI SEMICONDUCTOR CO., LTD. 发明人 YAMANOBE TOMOMI;YOSHIE TORU
分类号 H01L21/04 主分类号 H01L21/04
代理机构 代理人
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