| 摘要 |
A method of manufacturing a piezoelectric element includes the steps of: forming a piezoelectric film in epitaxial growth or orientated growth; forming an upper electrode and a lower electrode on the piezoelectric film; heating the piezoelectric film to a temperature equal to or greater than a temperature at which a coercive electric field of the piezoelectric film becomes 0 V or lower; applying, to the piezoelectric film, an electric field in an opposite direction to a direction of orientation of the piezoelectric film while maintaining the temperature to which the piezoelectric film is heated in the heating step; and lowering a temperature of the piezoelectric film to a temperature of 1/3 of the Curie temperature or lower while maintaining an electric field of a magnitude equal to or greater than the coercive electric field applied to the piezoelectric film after the electric field application step, and then releasing the electric field applied to the piezoelectric film.
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