| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily respond to dimensional change of bumps without generating gaps. <P>SOLUTION: In a method of processing a wafer 20 having a surface on which bumps B are formed and a surface protection film 11 is adhered, the edge face of a housing 40 placed around a table 51 for holding the wafer thereon is ground so as to be a predetermined thickness and the wafer is placed on the housing with its backside 22 being upwards. It is also possible to ground the backside of the wafer, subsequently. In addition, it is preferable for a predetermined thickness to be equal to the distance between the surface of the wafer and the apices of the bumps. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
