METHOD OF MANUFACTURING ELECTRONIC CIRCUIT BOARD AND ELECTRONIC CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit board capable of definitely forming a conductor that is to be an electrode or interconnect by efficiently attaching and depositing conductive metal particles onto throughout holes or blind holes beforehand formed in the electronic circuit board. SOLUTION: The method of forming a conductor that is to be an electrode or interconnect by attaching and depositing conductive metal particles onto the throughout holes or blind holes beforehand formed in the electronic circuit board with cold spray process. The conductive metal particles and pressurized mixed gas of a temperature of 20 to 400°C are jetted into the throughout holes or blind holes, thereby plastically deforming the conductive metal particles with the solid state kept as it stand to be attached and deposited in the holes to fill them with the metal particles. COPYRIGHT: (C)2009,JPO&INPIT