| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board with a structure different from the conventional structure, and to provide a manufacturing method thereof. <P>SOLUTION: The wiring board is a wiring board 1 having a first principal surface 6a and a second principal surface 6b opposed to the first principal surface 6a, and has a plurality of wiring layers (81, 82, 83, 84) and a through-hole 30 penetrating between at least one pair of adjacent wiring layers among those wiring layers in the lamination direction of the wiring layers. Then the through-hole 30 has a flat surface (21) which has conductivity in at least a partial region on its surface and is electrically parted into at least two blocks. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
