| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method of a semiconductor device, along with a probing apparatus, which assures electric contact between a probe needle and a metal pad on the surface of a semiconductor device when inspecting electric characteristics of the semiconductor device using the probe needle, for assured inspection of electric characteristics. SOLUTION: In the inspection method for a semiconductor device 70, a probe needle 31 is made to contact a metal pad 71 on the surface of the semiconductor device 70 to inspect electric characteristics of the semiconductor device 70. The method is characterized in that the semiconductor device 70 is vibrated in a vertical direction when the probe needle 31 contacts the metal pad 71. COPYRIGHT: (C)2009,JPO&INPIT
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