Chip scale package using large ductile solder balls

摘要

A chip scale (8) package comprising in combination:
a. an integrated circuit (10) formed upon a semiconductor die, said semiconductor die having a front surface (12) and an opposing rear surface (16), said semiconductor die including a plurality of conductive bond pads (18, 20) formed upon the front surface thereof for making electrical interconnections to said integrated circuit;
b. a patterned metal layer (30) formed over the front surface (12) of said semiconductor die, said patterned metal layer providing a plurality of solder bump pads (26) upon the front surface of said semiconductor die, and said patterned metal layer electrically coupling said conductive bond pads to said plurality of solder bump pads;
c. a plurality of ductile solder balls (28), each of said ductile solder balls being secured to a corresponding one of said solder bump pads, each of said ductile solder balls having a generally spherical shape and measuring at least 9 mils (.009 inch) in diameter.