| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus, in which a thin film in a bonding object is not ruptured, even when an arc discharge is induced between a bonding wire and a torch electrode, in the bonder wherein the tip of the bonding wire is fused by applying a high voltage between the bonding wire and the torch electrode, and inducing the arc discharge between these, a discharge means to form a ball there is included, and the ball formed by the discharge means is combined with a pad of the object of bonding. <P>SOLUTION: A shield member is provided to shield the bonding object 12 from electromagnetic waves generated by the arc discharge at forming the ball. The shield member is composed of, for example, a conductive plate material 10 which separates the bonding wire (gold wire 3) and the torch electrode 6 from the bonding object 12. When a gold ball 3a moves toward the pad of the bonding object 12, the plate material is constituted so that its passing is not be interrupted. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
