| 摘要 |
<P>PROBLEM TO BE SOLVED: To house a very fragile and delicate wafer in a housing by laminating in multilevel form without breakage. <P>SOLUTION: The semiconductor wafer W is housed in a tray 3 with its both surfaces sandwiched by spacer sheets 2, 2. The tray 3 housing the semiconductor wafer W are stacked in not less than two stages and the laminate is housed in a containment vessel through cushions. The cushions are compressed in a covered containment vessel and the compressive force are applied only to the laminate of the tray of each stage. A support 13b of the lower stage tray 3b is fitted within a support 12a of the upper tray 3a in the tray 3 of each stage stacked in not less than 2 stages, the semiconductor wafer W is housed in the housing space between the upper and lower trays 3a, 3b without the compressive force applied. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
