发明名称 MULTILAYER DIELECTRIC SUBSTRATE AND SEMICONDUCTOR PACKAGE
摘要 A multilayer dielectric substrate 2 in which a cavity 33 is formed on a substrate and semiconductor devices 3 are mounted in the cavity 33 includes openings 50 formed in surface-layer grounding conductors 18 arranged on the substrate in the cavity 33, impedance transformers 60 electrically coupled with the cavity 33 via the openings 50 and having a length of about 1/4 of an in-substrate effective wavelength of a signal wave, short-circuited-end dielectric transmission lines 80 having a length of about 1/4 of the in-substrate effective wavelength of the signal wave, coupling openings 65 formed in inner-layer grounding conductors in connecting sections of the impedance transformers 60 and the dielectric transmission lines 80, and resistors 70 formed in the coupling openings 65. The multilayer dielectric substrate 2 improves efficiency of absorption of radio waves to surely control cavity resonance and cause a semiconductor device and a transmission line to stably operate.
申请公布号 EP1775765(A4) 申请公布日期 2009.09.09
申请号 EP20050753423 申请日期 2005.06.24
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 SUZUKI, TAKUYA,
分类号 H01L23/12;H01L23/06;H01P1/162;H01P3/02;H01P5/08;H05K1/16 主分类号 H01L23/12
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