Printed circuit path arrangement for contacting electronic components

摘要

The arrangement e.g. printed circuit board (1a), has a conductive path-plane (81) with a conductor path (80), and a meander layer (48) arranged above and below the plane. Connections (30a) are provided on a main side and are connected with plated-through holes (92). The holes electrically contact the path and the meander layer. An electronic component e.g. semiconductor chip (11), is attached in a housing and monitors the path and the meander layer. The component is firmly arranged on the main side and exhibits contact elements e.g. ball grids (111), which are opposite to the connections.