| 摘要 |
<p>A Bernoulli wand (50) for transporting semiconductor wafers. The wand (50) has a head portion (54) having a plurality of gas outlets (74, 75) configured to produce a flow of gas along an upper surface of a wafer to create a pressure differential between the upper surface of the wafer and the lower surface of the wafer. The pressure differential generates a lift force that supports the wafer below the head portion (54) of the wand in a substantially non-contacting manner, employing the Bernoulli principle. The wand (50) has independently controllable gas channels (70, 80) configured to provide flow to different sets of gas outlet holes (74, 75). The gas outlet holes (74, 75) and gas channels (70, 80) are configured to support a wafer using the Bernoulli principle.</p> |
