Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate

摘要

To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety, (ii) acrylic compounds having general chemical formula I, and (iii) quaternary ammonium polymers having the following general chemical formula: {N + (R 3 )(R 4 )-(CH 2 ) a -N(H)-C(Y)-N(H)-(CH 2 ) b -N + (R 3 )(R 4 )-R 5 } n 2n X - , with R 1 , R 2 , R 3 , R 4 , R 5 , Y and X - being defined as claimed.