| 摘要 |
<p>An exposure apparatus and a device manufacturing method are provided to improve the precision of a correction value by making wafers grouped based on an analyzed result of the correction values. In an exposure apparatus and device manufacturing method, a grouping unit](103) is comprised in order to determine a reference substrate and a non-reference substrate in relation to a plurality of groups. A measuring unit(104) measures measuring points of a first number in relation to the reference substrate, and it measures a second number less than the first number in relation to the non-reference substrate. A correction value decision unit(105) determines a first correction value for positioning the reference substrate and the second correction value for positioning the non-reference substrate. A lithography unit(107) makes the reference and non-reference substrate exposed to the outside.</p> |
