发明名称 Method of manufacturing semiconductor device having multiple gate insulation films
摘要 A method of manufacturing a semiconductor device includes the steps of: preparing a semiconductor substrate having first and second element forming regions, the first and second element forming regions divided by an element separating insulation film; forming a first gate insulation film on the semiconductor substrate; forming a predetermined film on the first gate insulation film; forming a protective film on the predetermined film in the first element forming region; forming a second gate insulation film in the second element forming region by deforming the predetermined film into an insulation film using the protective film as a mask; removing the protective film and the remaining predetermined film which is not deformed into the insulated film; and forming gate electrodes on the first and second gate insulation films which are exposed by removing the remaining predetermined film.
申请公布号 US7585733(B2) 申请公布日期 2009.09.08
申请号 US20060275825 申请日期 2006.01.30
申请人 OKI SEMICONDUCTOR CO., LTD. 发明人 MUTO KOKI
分类号 H01L21/336 主分类号 H01L21/336
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