POLYAMIC ACID RESIN COMPOSITION, CURED FILM PRODUCED USING THE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a polyamic acid resin composition comprising a polyamic acid having an alkylene chain containing 5 to 20 carbon atoms as the main chain, which can be cured by heating at a temperature at which the rate of imidation becomes 80% or more to form a cured film having a tensile elastic modulus of not less than 100 MPa and less than 1500 MPa as measured at a film thickness of 20μm. It becomes possible to provide: a polyamic acid resin composition which comprises a polyimide resin precursor (a polyamic acid), which can form a thick film (not greater than 200°C) by only one coating operation (spin coating), has good workability at a lower temperature (not higher than 200°C), and enables to form a cured film having low warpage property, excellent heat resistance, insulating property, and low moisture-absorbability, and which is suitable as a protective coating agent for a semiconductor substrate; and a semiconductor device having a cured film produced from the resin composition.