发明名称 Plunger and chip-testing module applying the same
摘要 A plunger is suitable for a chip-testing module having a probe card, which has a circuit board and a membrane. The membrane has a circuit layer disposed on a first membrane surface of the membrane, conductive through-vias penetrating the membrane, and bumps disposed on a second membrane surface opposite to the first membrane surface, located in a pushed area of the membrane, and electrically connected to the circuit layer through the conductive through-vias. The plunger includes a body having a pushing part and a base part and a conductive layer disposed on a surface of the pushing part and the base part. Part of the circuit layer located in the pushed area is suitable for contacting and being electrically connected to part of the conductive layer located on the pushing part. The bumps are electrically connected to the conductive layer through the conductive through-vias.
申请公布号 US7586320(B2) 申请公布日期 2009.09.08
申请号 US20060484268 申请日期 2006.07.10
申请人 VIA TECHNOLOGIES, INC. 发明人 WU HSIN-KUAN;HSU HSING-CHOU
分类号 G01R31/02;G01R31/28 主分类号 G01R31/02
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