| 摘要 |
A photosensitive glass paste which can be burned at a low temperature in a short time and, through the burning step, can give a glass layer which has few voids therein and can inhibit silver diffusion; and a multilayer-wiring chip part having high characteristics which is produced with the glass paste. A sintering-aid glass is used in combination with a ceramic aggregate and a main-ingredient glass. It has a contact angle with the ceramic aggregate smaller than the contact angle of the main-ingredient glass with the ceramic aggregate. The proportion of the sintering-aid glass in the inorganic ingredients is 5-10 vol.%. The sintering-aid glass comprises SiO2, B2O3, CaO, Li2O, and ZnO in a given proportion. The main-ingredient glass comprises 70-90 wt.% SiO2, 15-20 wt.% B2O3, and 1-5 wt.% K2O.
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