发明名称 |
Packaged semiconductor die and manufacturing method thereof |
摘要 |
Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die substrate, a semiconductor package, and a sealant. The die substrate includes an insulating substrate and a circuit pattern formed on the insulating substrate. The semiconductor package has a semiconductor chip electrically coupled to the circuit pattern that is a known good package and is coupled to the die substrate. The sealant seals the semiconductor package. The packaged semiconductor die utilizes a known good package which has passed a series of package tests.
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申请公布号 |
US7586182(B2) |
申请公布日期 |
2009.09.08 |
申请号 |
US20050289665 |
申请日期 |
2005.11.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAEK SEUNG-DUK;KANG SUN-WON;PARK SANG-WOOK;LEE DONG-HO;LEE JONG-JOO |
分类号 |
H01L23/48;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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