| 发明名称 |
Method and apparatus for processing a wafer |
| 摘要 |
A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.
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| 申请公布号 |
US7585686(B2) |
申请公布日期 |
2009.09.08 |
| 申请号 |
US20070978004 |
申请日期 |
2007.10.26 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
VERHAVERBEKE STEVEN;TRUMAN J KELLY;LANE CHRISTOPHER T;SOMEKH SASSON R |
| 分类号 |
H01L21/66;B65G25/00;B66C17/08;H01L21/00 |
主分类号 |
H01L21/66 |
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