| 摘要 |
A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below. (wherein, R1 is selected from the group consisting of a hydrogen atom, and substituted or unsubstituted hydrocarbon groups of 1 to 18 carbon atoms, two or more R1 groups may be bonded together to form a cyclic structure, R2 and R3 are selected from the group consisting of a hydrogen atom, a hydroxyl group, and substituted or unsubstituted organic groups of 1 to 18 carbon atoms, two or more R2 or R3 groups may be bonded together to form a cyclic structure, YH represents an organic group of 0 to 18 carbon atoms containing one or more releasable protons (H+), and may be bonded to one or more R2 groups to form a cyclic structure, m represents an integer from 1 to 4, and p represents a number of 0 or greater).
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