| 摘要 |
A chassis assembly for an electronic device such as a storage device. The assembly includes a chassis for housing various functional components included in the electronic device. A sub-housing for containing a waste heat generating device, a device which requires temperature moderation, is included. The sub-housing defines a first airflow exhaust path for exhausting air in a first direction and a second airflow exhaust path for exhausting air in a second direction. The directing of airflow from the sub-housing is based on a chassis enclosure configuration such as to allow for the implementation of a common component including a component enclosure in a variety of chassis form factors. A method of controlling airflow in a electronic device enclosure includes the steps of utilizing a fan to generate a flow of air, directing the flow of air through a sub-housing including a waste heat generating device, and implementing the electronic device enclosure to selectively direct the exhaust path of the generated airflow from the sub-housing base on the configuration of the electronic device enclosure.
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