| 摘要 |
A dicing die attachment film is provided to remove the air bubble of neighboring area of the bonding wire by forming the protruding part and the concave part on the bonding surface of the die attachment film contacting to the bonding wire. A dicing die attachment film(100) comprises the die attachment film(120) and the dicing film(130). The die attachment film is adhered to the rear side of the semiconductor wafer. The dicing film is welded to the die attachment film. The bonding surface of the die attachment film is embossed in order to form the protrude part(121) and the concave part(122). The pitch between the protrude parts or the concave parts of the embossed die attachment film is smaller than 1/2 of the width of the bonding wire. |
