| 发明名称 |
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 摘要 |
Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.
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| 申请公布号 |
US7582510(B2) |
申请公布日期 |
2009.09.01 |
| 申请号 |
US20040595736 |
申请日期 |
2004.11.09 |
| 申请人 |
HENKEL CORPORATION |
发明人 |
TODD MICHAEL G.;HUNEKE JAMES T.;CRANE LAWRENCE N.;FISCHER GORDON C. |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/56;H01L21/60;H01L21/98;H01L25/065 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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