发明名称 |
Semiconductor device with enhanced breakdown voltage |
摘要 |
In a peripheral portion of an IGBT chip, an intermediate potential electrode (20) is provided between a field plate (14) and a field plate (15) on a field oxide film (13), to surround an IGBT cell. The intermediate potential electrode (20) is supplied with a prescribed intermediate potential between the potentials at an emitter electrode (10) and a channel stopper electrode (12) from intermediate potential applying means that is formed locally in a partial region on the chip peripheral portion.
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申请公布号 |
US7582918(B2) |
申请公布日期 |
2009.09.01 |
申请号 |
US20040981509 |
申请日期 |
2004.11.05 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TAKAHASHI TETSUO |
分类号 |
H01L21/328;H01L29/74;H01L21/331;H01L29/06;H01L29/40;H01L29/739;H01L29/78 |
主分类号 |
H01L21/328 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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