| 摘要 |
A wafer is placed on a rotatable stage to clean an upper surface of the wafer with a cleaning liquid while the stage and wafer are rotating. A cup-shaped cover is provided over the upper surface of the wafer. A frame portion of the cover is brought into close contact with a circumferential outer edge surface region of the wafer. Therefore, the upper surface of the wafer is cleaned without causing erosion in the circumferential outer edge surface region of the wafer. The shape of the cover is not limited to the cup-shape.
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