| 摘要 |
An apparatus for fixing a substrate and molding apparatus for manufacturing a semiconductor package are provided to prevent particles by blocking a vacuum hole. A substrate(S) for manufacturing a semiconductor package us fixed at a substrate fixing part(100). The substrate fixing part comprises the base body(110), the settling portion(120), and the elastic member(130) and the insertion part(140). The base body is fixed to the outer frame. The settling portion is installed on the top of the base body. The substrate is fixed to the settling portion. And the vacuum hole(122) is formed in the settling portion. The elastic member is installed between the base body and the settling portion.
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