| 摘要 |
An apparatus for processing a substrate is provided to prevent upward and downward bending in a narrow section of the substrate, thereby preventing damage of the substrate. In the first horizontal section(20), a substrate(10) on which the first solution(24) is coated by the first nozzle is transferred in parallel with the ground at height of the first level in the first direction. In the second horizontal section(40), the substrate from which the first solution is removed is parallel transferred. In the second horizontal section, the second solution(44) is coated on the substrate. In the second horizontal section, the second nozzle(43) of a restricted injection angle preventing flowing backward of the second solution is installed. A leading end unit of the substrate rises an upward section from the first level to the second level higher than the first level between the first and second horizontal sections to remove the first solution from the substrate. |
