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发明名称
多层印刷配线板及使用该配线板之安装体
摘要
本发明之多层印刷配线板系包含有表层形成有配线之复数印刷配线板、及连接于复数印刷配线板之间且含有无机填料、热硬化性树脂及用以缓和内部应力之缓和材的缓和连接层所构成,且藉设于内层之缓和连接层来吸收因回焊等所造成之加热冷却而导致发生的内部应力,因此可获得翘曲量少的多层印刷配线板。
申请公布号
TW200938013
申请公布日期
2009.09.01
申请号
TW098101345
申请日期
2009.01.15
申请人
松下电器产业股份有限公司
发明人
中村祯志;越后文雄;胜又雅昭
分类号
H05K1/02(2006.01);H05K3/46(2006.01)
主分类号
H05K1/02(2006.01)
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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