| 摘要 |
A die bonding apparatus for manufacturing semiconductor package and control method for operating the same are provided to distribute adhesive uniformly by increasing the pressure applied to the adhesive. The mount head(170) is prepared in the upper part separated from the printed circuit board(b) supported in the guide rail. The mount stage(140) is prepared in the bottom part separated from the printed circuit board in order to be faced with the mount head. The mount stage is located to the bottom side of the printed circuit board, mounting the die(d) to be bonded on the upper part. The mount head and mount stage are installed can be ascended and descended in the vertical direction.
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