| 摘要 |
A polishing apparatus and method are provided to lower the temperature of the edge region of an object by supplying cooling fluid to part of the object, thereby improving the flatness of polished surface. A polishing apparatus comprises a platen, a polishing head part(140) which polishes an object(142) while moving it relative to the platen, and a cooling unit(150) which is provided on the polishing head to cool a part of the object. The cooling unit provides cooling fluid to the polishing head, near the edge region of the object. |
