INSPECTING METHOD OF PROBING MARK FOR PROBING TESTER

摘要

A probing mark inspecting method for the probing test apparatus probe is provided to inspect the poor contact between the probe and the BIRA pad by contacting the probe to the bonding region. The rate of marking area about the pad area which the touch pad occupies or the bonding area and the location information are inputted(S100). A charge coupled device takes a picture of the semiconductor chip and the imaging image is obtained(S200). The confirmation device confirms the pad area from the imaging image(S250). The confirmation device divides the pad area into the marking area and the bonding area(S450). The confirmation device detects the probing mark in the marking area(S500). The determining unit determines the poor contact of the probe and the touch pad from the detection result of the confirmation device(S550).