发明名称 MULTI-LAYER CIRCUIT BOARD AND PRODUCTION METHOD THEREOF
摘要 OF THE DISCLOSURE MUUI'I-LAYFR CIRCUIT BOARD AND PRODUCTION METHOD THEREOF THE INVENTION PROVIDES A 111LILTI-LAVER CIRCUIT BOARD SEQUENTIALLY HAVING ALL I 1 5 INSULATING SUBSTIATE. A FIRST ELECTRICALLY CONDUCTIVE PATTERN ARBITRAI ILY FORMED,AN I1ISULATING MATERIAL LAYER AND A SECOND ELECTRICALLY CONDUCTIVE PATTERN FORMED BY PROVLDING AN ELECTRICALLY C011CILLCTIVE MATERIAL ON ,I GRATI POLYMER PATTERN T6RILLED (III THE INSUKITING MATERIAL LAYER, AND HAVILIG MI ELCCTFICDL1V CONDUCTIVC I)ATH WHICH CICCTRICALLY CONNECTS THE FIRST ELECTRICALLY CONDUCTIVE PATTERN PRESENT OR) THE @NSULATING SUBSTRATE AND 10 THE SECOND ELECTIICALLV CONDUCTIVE PATTEM. THE GRALL POLYMER PATTERN INCLUDES A COMBINATION OF AT LEAST ONE IC-NON %,HERE A GLAN POLYMER IS PLESENT AND AT )EAST ONE REGION %,HERE NO ORAFT POLYMER IS PRESCRIT, OR A COMBINATION OFAT LEAST ONE REGION WHERE A HYDROPHILIC GIALI POLYMER IS PRESENT AND AT LEAST ONE REGION WHERE A HYDROPHOBIC GRATI POLYMER IS PRESENT. 15
申请公布号 MY139193(A) 申请公布日期 2009.08.28
申请号 MY2005PI02456 申请日期 2005.05.31
申请人 FUJI PHOTO FILM CO., LTD. 发明人 KOICHI KAWAMURA;TAKEYOSHI KANO
分类号 H05K3/46;H05K3/38 主分类号 H05K3/46
代理机构 代理人
主权项
地址