| 摘要 |
Glass compositions are provided that are useful in electronic applications, e.g., as reinforcements in printed circuit board substrates. Reduced dielectric constants are provided relative to E-glass, and fiber forming properties are provided that are more commercially practical than D-glass. Glass compositions comprise (in weight%); SiO2 60-68, Li2O 0-2, B2O3 7-13 Na2O 0-1, Al2O3 9-15 K2o 0-1, MgO 8-15 Fe2O3 0-1, GO 0-4 F2 0-1, TiO2 0-2, other constituents 0-5. ® KIPO & WIPO 2009
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