SEMICONDUCTOR PACKAGE

摘要

A semiconductor package is provided to prevent the area of input/output pattern when the semiconductor device is laminated by the electric connection through the interposer. The first semiconductor device(100) comprises the first semiconductor die(120) formed on the top of the first circuit substrate(110). An interposer(200) comprises at least one conductive conjunction material which is electrically connected to the first semiconductor device. The second circuit substrate(310) is electrically connected to the interposer. The second semiconductor device(300) has the second semiconductor die(320) formed on the top of the second circuit substrate. The second semiconductor device and the interposer are electrically connected by a solder ball(350).