METHOD OF MANUFACTURING CORELESS PRINTED CIRCUIT BOARD

摘要

A manufacturing method of a coreless PCB is provided to facilitate a die bonding process by improving planarity of a coreless package substrate. A tin plating layer is formed on a whole surface of a carrier. An insulation layer(30) is laminated on the tin plating layer. The insulation layer is etched in order to selectively expose the tin plating layer. An Au/Ni/Cu structure is formed on an exposed surface of the tin plating layer through Au plating/Ni plating/Cu plating. A copper plating layer is formed on a whole surface of a substrate by electroless copper plating. A copper foil circuit is formed by selectively etching the copper plating layer. A solder resist(120) is coated on the copper foil circuit. A nickel plating layer and a gold plating layer are formed on a copper plating pad. A copper foil of the carrier is removed by an alkali etching. The tin plating layer is removed from the carrier.