STRUCTURE BODY FOR FIXING SEMICONDUCTOR DEVICE

摘要

A semiconductor devices fixing structure capable of separating and absorbing the semiconductor devices to one body is provided to prevent the damage of the semiconductor devices by equipping a plurality of elastic bodies between a base and a body. A pair of semiconductor receiving grooves guides the fixing and cohesion of semiconductor devices. The semiconductor accommodating grooves are formed in a body(120). The through holes are connected with the semiconductor accommodating grooves. The body is fixed to the plate through a base(110) to the combined state. The semiconductor devices are settled within the semiconductor accommodating grooves. An isolation preventing unit fixes the upper sides of the semiconductor devices.